Continuous Hot Melt ProductionSource: K-Tron
Adhesives are characterized by the fact that they adhere simply through pressing together the parts of the joint which requires bonding. They demonstrate a lasting and permanent adhesive effect at room temperature.
Hot melt adhesives are solvent free adhesives, which are characteristically solid at temperatures below 180°F (82°C), are low viscosity fluids above 180°F, and set rapidly upon cooling. The development of hot melt adhesive technology stemmed from the previous use of molten wax for bonding. When this method no longer satisfied performance needs, 100% thermoplastic systems were introduced. Today, hot melt adhesives are used in a variety of manufacturing processes, including bookbinding, product assembly, and box and carton heat sealing.